TechConnect World Innovation Conference and Expo Innovation Submission Deadline
January 22, 2016
Details
Call for Innovations to the TechConnect World Innovation Conference in Washington DC, May 22-25, 2016.
Submit your innovation by TODAY to access:
– $20 billion in Corporate Prospectors
– $5 billion in Agency Funding
– Agency & Corporate One-on-Ones
– Pitching your technology
Share
